Patent Assignment
Reel/Frame 048866/0786
Assignment of Assignor's Interest
Recorded: 2019-04-12
Pages: 3
Assignor
HUANG, YIMIN
Executed: 2019-03-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Photo Diode with Dual Backside Deep Trench Isolation Depth