Patent Assignment
Reel/Frame 048878/0796
Assignment of Assignor's Interest
Recorded: 2019-04-13
Pages: 3
Assignors
WAN, ZHIMIN
Executed: 2019-04-09
KLEIN, STEVEN A.
Executed: 2019-04-09
CHIU, CHIA-PIN
Executed: 2019-04-10
DEVASENATHIPATHY, SHANKAR
Executed: 2019-04-08
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Integrated Circuit Package Socket Housing to Enhance Package Cooling