Patent Assignment
Reel/Frame 048879/0757
Assignment of Assignor's Interest
Recorded: 2019-04-12
Pages: 2
Assignor
YAMAKAWA, SHINYA
Executed: 2019-03-26
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 2430014, JAPAN
Covered Property
(1)
Solid-State Imaging Device, Manufacturing Method Thereof, and Electronic Device