Patent Assignment
Reel/Frame 048880/0579
Assignment of Assignor's Interest
Recorded: 2019-04-15
Pages: 14
Assignors
KIM, WON-KEUN
Executed: 2019-01-21
OH, KYUNG-SUK
Executed: 2019-01-21
KO, JI-HAN
Executed: 2019-01-21
KIM, KIL-SOO
Executed: 2019-01-21
KIM, YEONG-SEOK
Executed: 2019-01-21
LEE, JOUNG-PHIL
Executed: 2019-01-22
JIN, HWA-IL
Executed: 2019-01-22
HYUNG, SU-JUNG
Executed: 2019-04-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Having Improved Thermal Discharge and Electromagnetic Shielding Characteristics