Patent Assignment
Reel/Frame 048889/0996
Assignment of Assignor's Interest
Recorded: 2019-04-16
Pages: 4
Assignors
CHU, YUNG-CHI
Executed: 2019-03-13
KUO, HUNG-JUI
Executed: 2019-03-13
HU, YU-HSIANG
Executed: 2019-03-13
CHEN, WEI-CHIH
Executed: 2019-03-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Manufacturing the Same