Patent Assignment
Reel/Frame 048894/0156
Assignment of Assignor's Interest
Recorded: 2019-04-16
Pages: 4
Assignors
LI, CHENG-CHIEH
Executed: 2019-04-09
WANG, PU
Executed: 2019-04-09
WU, CHIH-WEI
Executed: 2019-04-02
SHIH, YING-CHING
Executed: 2019-04-02
LU, SZU-WEI
Executed: 2019-04-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Method for Forming the Same