Patent Assignment
Reel/Frame 048897/0859
Assignment of Assignor's Interest
Recorded: 2019-04-16
Pages: 7
Assignors
PARK, DOO-HWAN
Executed: 2018-12-04
PARK, SEONG HO
Executed: 2018-12-04
PARK, KYOUNG PIL
Executed: 2018-12-04
BAE, TAE YONG
Executed: 2018-12-04
SEO, EUN-CHUL
Executed: 2018-12-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method for Fabricating Thereof