Patent Assignment
Reel/Frame 048925/0056
Assignment of Assignor's Interest
Recorded: 2019-04-18
Pages: 9
Assignors
LIN, JYUN-YING
Executed: 2017-09-08
CHENG, HSIN-LI
Executed: 2017-09-08
YANG, JING-HWANG
Executed: 2017-09-08
TSUI, FELIX YING-KIT
Executed: 2017-09-07
KUO, CHIEN-LI
Executed: 2017-09-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Low Warpage High Density Trench Capacitor