Patent Assignment
Reel/Frame 048935/0888
Assignment of Assignor's Interest
Recorded: 2019-04-19
Pages: 8
Assignors
SANKMAN, ROBERT
Executed: 2019-02-27
GANESAN, SANKA
Executed: 2019-02-27
WAIDHAS, BERND
Executed: 2019-03-05
WAGNER, THOMAS
Executed: 2019-04-11
KESER, LIZABETH
Executed: 2019-04-11
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Chip Scale Thin 3D Die Stacked Package