Patent Assignment
Reel/Frame 048953/0118
Assignment of Assignor's Interest
Recorded: 2019-04-22
Pages: 4
Assignee
TOKYO ELECTRON LIMITED
3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Placing Apparatus and Substrate Placing Method