Patent Assignment
Reel/Frame 048955/0266
Assignment of Assignor's Interest
Recorded: 2019-04-22
Pages: 7
Assignors
CHOI, JONG-HYUN
Executed: 2019-02-28
MOON, SEOK-BAE
Executed: 2019-02-28
CHOI, JAE-HYUK
Executed: 2019-02-28
PARK, WON-KI
Executed: 2019-02-28
SEO, JONG-HWI
Executed: 2019-02-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Quality Inspection Method and Apparatus, and Semiconductor Device Manufacturing Method Including the Wafer Quality Inspection Method