IP Library › Assignment 048970/0123
Patent Assignment
Reel/Frame 048970/0123

Assignment of Assignor's Interest

Recorded: 2019-04-23 Pages: 6
Assignor
BUTLER, BRADY G.
Executed: 2018-10-30
Assignee
BOOZ ALLEN HAMILTON
8283 GREENSBORO DRIVE, MCLEAN, VIRGINIA, 22102
Covered Property (1)
High-Density Thermodynamically Stable Nanostructured Copper-Based Bulk Metallic Systems, and Methods of Making the Same
Application: 15/092,702 →
Publication: US 2016/0319397
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 23, 2019
From: KECSKES, LASZLO J.; ROBERTS, ANTHONY J.; DARLING, KRISTOPHER A.
To: THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY
Reel/Frame 048969/0629 →
Assignment of Assignor's Interest Apr 23, 2019
From: GALLAGHER, MICAH J.
To: BOWHEAD SCIENCE AND TECHNOLOGY, LLC
Reel/Frame 048969/0900 →
Assignment of Assignor's Interest Apr 23, 2019
From: BOOZ ALLEN HAMILTON
To: THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY
Reel/Frame 048969/0972 →
Assignment of Assignor's Interest Apr 23, 2019
From: BOWHEAD SCIENCE AND TECHNOLOGY, LLC
To: THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY
Reel/Frame 048976/0497 →