Patent Assignment
Reel/Frame 048971/0572
Assignment of Assignor's Interest
Recorded: 2019-04-23
Pages: 3
Assignor
SHENG, LIEYI
Executed: 2019-04-09
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
System for and Method of Manufacture Using Multimodal Analysis
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 23, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 050156/0421 →
Release of Security Interest in Patents Previously Recorded at Reel 050156, Frame 0421
Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0639 →