IP Library Granted Patent US 11,152,236
Granted Patent B2
US 11,152,236 · App. 16/391,977 · Granted Oct 19, 2021

System for and method of manufacture using multimodal analysis

Inventor: Lieyi Sheng (Pocatello, ID)
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
H01L21/67276G05B19/408G05B19/4187H01L21/67155H01L21/67253
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Quick Facts
Patent No.
US 11,152,236
App. No.
16/391,977
Granted
Oct 19, 2021
Kind
B2
Abstract

The disclosed embodiments include systems and methods of manufacturing a product. The system may include a non-transitory computer readable medium comprising computer readable program code for performing the method. The method may include manufacturing batches of the product according to steps of a process flow, determining output data for each batch, sequencing the batches by output data, determining a plurality of modes of output data based on grouping the batches, identifying a detrimental factor to output data in a process flow step based on a correlation between the process flow step and a mode of the plurality of modes, and correcting the detrimental factor.

Claims (37)

1. A non-transitory computer readable medium comprising computer readable program code for:

determining a yield loss for each of a plurality of batches of a product manufactured according to steps of a process flow;

categorizing at least some of the plurality of batches into at least one bin based on a type of the yield loss;

sequencing the batches in the at least one bin by yield loss;

determining a plurality of modes of yield loss of the batches in the bin based on grouping the batches in the bin; and

identifying a detrimental factor in a process flow step causing the yield loss of the batches in the bin based on a mode of the batches in the bin.

2. The computer readable medium of claim 1 further comprising computer readable program code for correcting the detrimental factor.

3. The computer readable medium of claim 2 , wherein correcting the detrimental factor comprises eliminating, revising, altering, correcting a tool subset in the process flow, or any combination thereof.

4. The computer readable medium of claim 1 further comprising computer readable program code for organizing the product into the batches.

5. The computer readable medium of claim 1 , wherein the product comprises a semiconductor wafer or a semiconductor wafer comprising a plurality of integrated circuits.

6. The computer readable medium of claim 1 , wherein the product comprises an electrical component, an automotive control circuit, a chemical product, or any combination thereof.

7. The computer readable medium of claim 1 , wherein sequencing the batches by output data comprises sequencing the batches from low yield loss to high yield loss.

8. The computer readable medium of claim 1 , wherein determining a plurality of modes comprises grouping the batches according to the percentage of yield loss.

9. The computer readable medium of claim 1 , wherein identifying the detrimental factor comprises identifying tool subsets used at a specific step in the process flow.

10. A method of manufacturing a product, comprising:

manufacturing batches of the product according to steps of a process flow;

determining output data for each batch;

sequencing the batches by output data;

determining a plurality of modes of output data based on grouping the batches;

identifying a detrimental factor to output data in a process flow step based on a correlation between the process flow step and a mode of the plurality of modes; and

correcting the detrimental factor.

11. The method of claim 10 , wherein correcting the detrimental factor comprises eliminating, revising, altering, correcting, or any combination thereof a tool subset in the process flow.

12. The method of claim 10 , comprising organizing the product into the batches.

13. The method of claim 10 , wherein sequencing the batches by output data comprises sequencing the batches from low yield loss to high yield loss.

14. The method of claim 10 , wherein identifying the detrimental factor comprises identifying tool subsets used at a specific step in the process flow.

15. A system for manufacturing a product, comprising:

manufacturing operations for manufacturing a product in batches according to a process flow; and

a processor comprising instructions for:

determining output data for each batch;

sequencing the batches by output data;

determining a plurality of modes of output data based on grouping the batches; and

identifying a detrimental factor to output data in one of the manufacturing operations based on a correlation between the process flow step and a mode of the plurality of modes.

16. The system of claim 10 , wherein the identified detrimental factor is correctable.

17. The system of claim 10 , wherein the product comprises a semiconductor wafer, a semiconductor wafer comprising a plurality of integrated circuits, an electrical component, an automotive vehicle, a chemical product, a device, or any combination thereof.

18. The system of claim 15 , wherein the instructions for identifying the detrimental factor comprise instructions for identifying tool subsets used at a specific step in the process flow.

19. The system of claim 15 , wherein the instructions for determining a plurality of modes comprise instructions for grouping the batches according to the percentage of yield loss.

20. The system of claim 15 , wherein the instructions for sequencing the batches by output data comprise instructions for sequencing the batches from low yield loss to high yield loss.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL 050156, FRAME 0421 Recorded Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0639 →
SECURITY INTEREST Recorded Aug 23, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 050156/0421 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2019
From: SHENG, LIEYI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 048971/0572 →
Continuity (2)
Provisional Application 62664797 · Apr 30, 2018
Related Publication 20190333795A1 · Oct 31, 2019