Patent Assignment
Reel/Frame 048972/0509
Assignment of Assignor's Interest
Recorded: 2019-04-23
Pages: 6
Assignors
JUNG, KYOOHO
Executed: 2019-03-19
KANG, SANGYEOL
Executed: 2019-03-19
CHO, KYUHO
Executed: 2019-03-19
KIM, EUNSUN
Executed: 2019-03-19
MUN, HYOSIK
Executed: 2019-03-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO,, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same