IP Library › Assignment 048975/0154
Patent Assignment
Reel/Frame 048975/0154

Assignment of Assignor's Interest

Recorded: 2019-04-23 Pages: 11
Assignors
CHOI, JAE SIK
Executed: 2019-04-10
JEONG, JIN WON
Executed: 2019-04-10
KIM, DO YOUNG
Executed: 2019-04-10
LEE, HYE JI
Executed: 2019-04-15
SONG, BYEUNG SOO
Executed: 2019-04-10
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO, CHEONGJU-SI, 28429, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Package and Method of Manufacturing Semiconductor Package
Application: 16/392,388 →
Publication: US 2020/0035644
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tunc Assignment Mar 14, 2024
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: MAGNACHIP MIXED-SIGNAL, LTD.
Reel/Frame 066878/0875 →
Assignment of Assignor's Interest Jul 7, 2025
From: MAGNACHIP MIXED-SIGNAL, LTD.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 071813/0800 →