Patent Assignment
Reel/Frame 049005/0474
Assignment of Assignor's Interest
Recorded: 2019-04-26
Pages: 4
Assignors
LIM, JINHO
Executed: 2019-04-04
BAE, SEUNGJAE
Executed: 2019-04-04
KIM, YONGHWA
Executed: 2019-04-04
SIM, BOKYUNG
Executed: 2019-04-04
YOON, BYOUNGUK
Executed: 2019-04-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Conduit Structure of Electronic Device and Electronic Device Including the Same