Patent Assignment
Reel/Frame 049007/0316
Assignment of Assignor's Interest
Recorded: 2019-04-26
Pages: 5
Assignors
KRISHNAN, SHUTESH
Executed: 2017-07-20
WANG, SW
Executed: 2017-07-20
CHEW, CH
Executed: 2017-07-20
LIEW, HOW KIAT
Executed: 2017-07-20
TAN, FUI FUI
Executed: 2017-07-20
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Thin Semiconductor Package and Related Methods
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 23, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 050156/0421 →
Release of Security Interest in Patents Previously Recorded at Reel 050156, Frame 0421
Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0639 →