IP Library Assignment 049017/0602
Patent Assignment
Reel/Frame 049017/0602

Assignment of Assignor's Interest

Recorded: 2019-04-29 Pages: 6
Assignors
LIN, YUSHENG
Executed: 2015-02-11
CARNEY, FRANCIS J.
Executed: 2015-02-17
CHEW, CHEE HIONG
Executed: 2015-02-16
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Semiconductor Package with Elastic Coupler and Related Methods
Application: 16/396,904 →
Publication: US 2019/0252275
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 23, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 050156/0421 →
Release of Security Interest in Patents Previously Recorded at Reel 050156, Frame 0421 Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0639 →