Patent Assignment
Reel/Frame 049026/0149
Assignment of Assignor's Interest
Recorded: 2019-04-29
Pages: 4
Assignors
DOGIAMIS, GEORGIOS
Executed: 2019-03-13
ALEKSOV, ALEKSANDAR
Executed: 2019-03-14
ELSHERBINI, ADEL A.
Executed: 2019-03-13
BRAUNISCH, HENNING
Executed: 2019-03-13
SWAN, JOHANNA M.
Executed: 2019-03-13
KAMGAING, TELESPHOR
Executed: 2019-03-13
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
A Dielectric Waveguide Channel for Interconnecting Dies in a Semiconductor Package Usable in a Computing Device and Method of Manufacture