Patent Assignment
Reel/Frame 049031/0509
Assignment of Assignor's Interest
Recorded: 2019-04-30
Pages: 4
Assignee
SHIN-ETSU CHEMICAL CO., LTD.
6-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, 100-0004, JAPAN
Covered Property
(1)
Method of Transferring Device Layer to Transfer Substrate and Highly Thermal Conductive Substrate