Patent Assignment
Reel/Frame 049039/0687
Assignment of Assignor's Interest
Recorded: 2019-04-30
Pages: 4
Assignors
LEE, JAE EAN
Executed: 2018-02-19
JEONG, TAE SUNG
Executed: 2018-02-19
KO, YOUNG GWAN
Executed: 2018-02-19
CHOI, IK JUN
Executed: 2018-02-19
BYUN, JUNG SOO
Executed: 2018-02-19
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Carrier Substrate and Method of Manufacturing Semiconductor Package Using the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.