Patent Assignment
Reel/Frame 049039/0974
Assignment of Assignor's Interest
Recorded: 2019-04-30
Pages: 8
Assignors
LIU, NAI-WEI
Executed: 2019-04-26
CHI, YEN-YAO
Executed: 2019-04-26
LIN, TZU-HUNG
Executed: 2019-04-24
HSU, WEN-SUNG
Executed: 2019-04-26
Assignee
MEDIATEK, INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU 300, ROC, TAIWAN
Covered Property
(1)
Semiconductor Package with Antenna and Fabrication Method Thereof