Patent Assignment
Reel/Frame 049055/0645
Assignment of Assignor's Interest
Recorded: 2019-05-01
Pages: 5
Assignors
HSU, I-WEN
Executed: 2018-11-07
PENG, YU-YUN
Executed: 2018-11-07
SHEU, AN-DI
Executed: 2019-03-09
CHEN, JEI-MING
Executed: 2018-11-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Forming the Same