Patent Assignment
Reel/Frame 049055/0869
Assignment of Assignor's Interest
Recorded: 2019-05-01
Pages: 3
Assignors
LUI, TUNG CHING
Executed: 2019-03-22
CANETE, BALTAZAR
Executed: 2019-03-22
AIYANDRA, RAJESH
Executed: 2019-03-22
Assignee
DIALOG SEMICONDUCTOR (UK) LIMITED
TOWER BRIDGE HOUSE, ST. KATHARINE'S WAY, LONDON, E1W 1AA, UNITED KINGDOM
Covered Property
(1)
Thermal Enhancement of Exposed Die-Down Package
Patent:
10,764,989 →
Application:
16/363,556 →