Patent Assignment
Reel/Frame 049059/0852
Assignment of Assignor's Interest
Recorded: 2019-05-02
Pages: 5
Assignors
LEE, JONG PIL
Executed: 2019-02-07
TANAKA, ICHIRO
Executed: 2019-02-07
YOO, DOO HO
Executed: 2019-02-08
CHOI, HYUN JUN
Executed: 2019-02-07
KIM, HYUNG GON
Executed: 2019-02-07
ROH, HYUNG SEOK
Executed: 2019-02-07
KIM, JUNG IL
Executed: 2019-02-07
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Component and Manufacturing Method Thereof