Patent Assignment
Reel/Frame 049086/0348
Assignment of Assignor's Interest
Recorded: 2019-05-05
Pages: 11
Assignors
YEN, YOU-LUNG
Executed: 2019-04-30
APPELT, BERND KARL
Executed: 2019-04-29
ESSIG, KAY STEFAN
Executed: 2019-04-29
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same