Patent Assignment
Reel/Frame 049086/0429
Assignment of Assignor's Interest
Recorded: 2019-05-06
Pages: 3
Assignors
KUO, CHIH-YAO
Executed: 2019-05-03
SUN, CHIN-KAI
Executed: 2019-05-03
CHU, CHUN-LUNG
Executed: 2019-05-03
LIU, WEI-CHENG
Executed: 2019-05-03
Assignee
HTC CORPORATION
NO. 23, XINGHUA ROAD, TAOYUAN DISTRICT,, TAOYUAN CITY, 330, TAIWAN
Covered Property
(1)
Heat Dissipation Module and Electronic Device
Patent:
10,785,893 →
Application:
16/403,616 →