Patent Assignment
Reel/Frame 049096/0956
Assignment of Assignor's Interest
Recorded: 2019-05-07
Pages: 7
Assignors
CHOI, JU-IL
Executed: 2019-03-20
KANG, PIL-KYU
Executed: 2019-03-20
KIM, HOECHUL
Executed: 2019-03-20
NA, HOONJOO
Executed: 2019-03-21
PARK, JAEHYUNG
Executed: 2019-03-20
SON, SEONGMIN
Executed: 2019-03-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Interconnection Structure Including Copper and Tin and Semiconductor Package Including the Same