Patent Assignment
Reel/Frame 049097/0139
Assignment of Assignor's Interest
Recorded: 2019-05-07
Pages: 6
Assignors
LEE, CHANG-YEON
Executed: 2019-02-08
LEE, JIN-WOOK
Executed: 2019-02-08
GWAK, MIN-CHAN
Executed: 2019-02-08
BAEK, KYE-HYUN
Executed: 2019-02-23
PARK, HONG-BAE
Executed: 2019-02-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device Including an Overhanging Hard Mask Layer