Patent Assignment
Reel/Frame 049100/0495
Assignment of Assignor's Interest
Recorded: 2019-05-07
Pages: 4
Assignor
CHEN, HUA-FENG
Executed: 2019-04-12
Assignee
ADLINK TECHNOLOGY INC.
9F, NO. 166, JIAN YI ROAD, ZHONGHE DISTRICT,, NEW TAIPEI CITY, TAIWAN
Covered Property
(1)
Heat-Dissipating Module Having an Elastic Mounting Structure
Patent:
10,764,990 →
Application:
16/391,963 →