Corrective Assignment to Correct the No Change to Receiving Party Address Previously Recorded at Reel: 48306 Frame: 532. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2019-04-02 Pages: 11

Assignors

WU, YU-BEY

Executed: 2017-04-10

CHEN, DIAN-HAU

Executed: 2017-04-10

CHENG, JYE-YEN

Executed: 2017-04-17

WEI, SHENG-HSUAN

Executed: 2017-04-12

LEE, LI-YU

Executed: 2017-04-10

WU, TAIYANG

Executed: 2017-12-22

Assignee

NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN

Covered Property (1)

Semiconductor Device and Manufacturing Method Thereof

Patent: 10,879,179 →

Application: 16/224,031 →

Publication: US 2019/0157204

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.