Patent Assignment
Reel/Frame 049131/0772
Assignment of Assignor's Interest
Recorded: 2019-05-09
Pages: 3
Assignors
JENG, SHIN-PUU
Executed: 2019-04-22
CHEN, SHUO-MAO
Executed: 2019-04-22
HSU, FENG-CHENG
Executed: 2019-04-22
LIN, PO-YAO
Executed: 2019-04-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Chip Package Structure