Patent Assignment
Reel/Frame 049136/0695
Assignment of Assignor's Interest
Recorded: 2019-05-10
Pages: 2
Assignors
LIU, CHUNG-SHI
Executed: 2019-05-02
WU, JIUN YI
Executed: 2019-05-03
LEE, CHIEN-HSUN
Executed: 2019-05-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method