Patent Assignment
Reel/Frame 049150/0692
Assignment of Assignor's Interest
Recorded: 2019-05-11
Pages: 3
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Module, Manufacturing Method Thereof, and Communication Method Using the Same