Patent Assignment
Reel/Frame 049150/0699
Assignment of Assignor's Interest
Recorded: 2019-05-11
Pages: 3
Assignor
KANAZAWA, MASAAKI
Executed: 2019-01-07
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Method for Manufacturing a Semiconductor Device