Patent Assignment
Reel/Frame 049159/0194
Assignment of Assignor's Interest
Recorded: 2019-05-13
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer-Level Package Including Under Bump Metal Layer