Patent Assignment
Reel/Frame 049161/0448
Assignment of Assignor's Interest
Recorded: 2019-05-13
Pages: 9
Assignors
ANDO, MAKOTO
Executed: 2019-04-17
IZUMI, TATSUNORI
Executed: 2019-04-10
TANIMOTO, RYUICHI
Executed: 2019-04-10
MATSUNAGA, YUHEI
Executed: 2019-04-12
YAMADA, YASUO
Executed: 2019-04-10
Assignee
SUMCO CORPORATION
2-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8634, JAPAN
Covered Property
(1)
Wafer Edge Polishing Apparatus and Method