Patent Assignment
Reel/Frame 049164/0337
Assignment of Assignor's Interest
Recorded: 2019-05-13
Pages: 5
Assignors
WANG, JHIH-YU
Executed: 2019-04-26
KUO, HUNG-JUI
Executed: 2019-04-24
HU, YU-HSIANG
Executed: 2019-04-24
LIAO, SIH-HAO
Executed: 2019-04-24
CHU, YUNG-CHI
Executed: 2019-04-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Fabricating the Same