Patent Assignment
Reel/Frame 049173/0017
Assignment of Assignor's Interest
Recorded: 2019-05-14
Pages: 4
Assignor
SUK, KYOUNG LIM
Executed: 2019-03-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO,, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package, Method of Fabricating Semiconductor Package, and Method of Fabricating Redistribution Structure