Patent Assignment
Reel/Frame 049174/0846
Assignment of Assignor's Interest
Recorded: 2019-05-14
Pages: 5
Assignors
PIETAMBARAM, SRINIVAS V.
Executed: 2019-04-05
IBRAHIM, TAREK
Executed: 2019-04-09
DARMAWIKARTA, KRISTOF
Executed: 2019-04-15
MANEPALLI, RAHUL N.
Executed: 2019-04-05
MALLIK, DEBENDRA
Executed: 2019-04-08
SANKMAN, ROBERT L.
Executed: 2019-04-08
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Inorganic-Based Embedded-Die Layers for Modular Semiconductive Devices