Patent Assignment
Reel/Frame 049178/0823
Assignment of Assignor's Interest
Recorded: 2019-05-14
Pages: 7
Assignors
BAE, JIN WOO
Executed: 2019-02-09
SHIN, SU YOUNG
Executed: 2019-02-09
KOH, YOUNG HO
Executed: 2019-02-09
YOON, BO UN
Executed: 2019-02-11
YOON, IL YOUNG
Executed: 2019-02-09
LEE, YANG HEE
Executed: 2019-02-09
CHEON, HEE SOOK
Executed: 2019-02-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming Semiconductor Device