Patent Assignment
Reel/Frame 049179/0745
Assignment of Assignor's Interest
Recorded: 2019-05-15
Pages: 4
Assignors
TSAI, TSUNG-FU
Executed: 2019-05-03
YEH, KUNG-CHEN
Executed: 2019-05-03
HUANG, I-TING
Executed: 2019-05-03
LIN, SHIH-TING
Executed: 2019-05-03
LU, SZU-WEI
Executed: 2019-05-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method for Forming the Same