Patent Assignment
Reel/Frame 049199/0305
Assignment of Assignor's Interest
Recorded: 2019-05-16
Pages: 4
Assignors
DARMAWIKARTA, KRISTOF
Executed: 2019-05-14
PIETAMBARAM, SRINIVAS V.
Executed: 2019-05-14
FENG, HONGXIA
Executed: 2019-05-15
GUO, XIAOYING
Executed: 2019-05-14
DUONG, BENJAMIN T.
Executed: 2019-05-14
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95954
Covered Property
(1)
Etch Barrier for Microelectronic Packaging Conductive Structures