Patent Assignment
Reel/Frame 049214/0853
Assignment of Assignor's Interest
Recorded: 2019-05-17
Pages: 3
Assignor
KIMURA, NORIYUKI
Executed: 2019-04-17
Assignee
ABLIC INC.
8, NAKASE 1-CHOME, MIHAMA-KU,, CHIBA-SHI, CHIBA, 261-8507, JAPAN
Covered Property
(1)
Pre-Molded Substrate, Method of Manufacturing Pre-Molded Substrate, and Hollow Type Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.