Patent Assignment
Reel/Frame 049236/0001
Assignment of Assignor's Interest
Recorded: 2019-05-21
Pages: 5
Assignors
SAMESHIMA, TAKAFUMI
Executed: 2019-04-23
IIZUKA, YOSHIO
Executed: 2019-04-23
OSADA, KAHO
Executed: 2019-04-23
SHIMIZU, HIROSHI
Executed: 2019-04-24
Assignees
TOSHIBA KIKAI KABUSHIKI KAISHA
2-2, UCHISAIWAICHO 2-CHOME, CHIYODA-KU,, TOKYO, 100-8503, JAPAN
HSP TECHNOLOGIES INC.
TSUKUBA SO-GYOU PLAZA 103,2-1-6, SENGEN, TSUKUBA,, IBARAKI, 305-0047, JAPAN
Covered Property
(1)
Production Method for Conductive Composite Material
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.