Patent Assignment
Reel/Frame 049240/0266
Assignment of Assignor's Interest
Recorded: 2019-05-21
Pages: 5
Assignors
CHAE, SOO DOO
Executed: 2019-05-16
SMITH, JEFFREY
Executed: 2019-05-16
LEUSINK, GERRIT J.
Executed: 2019-05-16
CLARK, ROBERT D.
Executed: 2019-05-17
YU, KAI-HUNG
Executed: 2019-05-16
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Interconnect Structure and Method of Forming the Same