Patent Assignment
Reel/Frame 049250/0663
Assignment of Assignor's Interest
Recorded: 2019-05-22
Pages: 3
Assignors
CHEN, JIUN-TING
Executed: 2019-05-09
SHIH, YING-CHING
Executed: 2019-05-09
LU, SZU-WEI
Executed: 2019-05-09
WU, CHIH-WEI
Executed: 2019-05-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Package Structure and Method for Forming the Same