Patent Assignment
Reel/Frame 049268/0553
Assignment of Assignor's Interest
Recorded: 2019-05-23
Pages: 5
Assignors
SHAO, TUNG-LIANG
Executed: 2019-04-09
WANG, JEN-YU
Executed: 2019-04-22
WU, CHUNG-JUNG
Executed: 2019-05-13
TUNG, CHIH-HANG
Executed: 2019-04-23
YU, CHEN-HUA
Executed: 2019-04-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package with Composite Thermal Interface Material Structure and Method of Forming the Same