IP Library › Assignment 049276/0360
Patent Assignment
Reel/Frame 049276/0360

Assignment of Assignor's Interest

Recorded: 2019-05-24 Pages: 3
Assignors
BAE, SUNG HAWN
Executed: 2019-01-28
HAN, PYUNG HWA
Executed: 2019-01-28
KIM, JUNG SOO
Executed: 2019-01-28
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG) YOUNGTONG-GU, SUSON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Package Having Mark with Identification Information
Application: 16/371,653 →
Publication: US 2020/0105679
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →